Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com
86-755-29082440
Product Details
|
Name:
|
Thermal Conductive Silicone Film
|
Test Item:
|
Thermal Conductivity
|
Unit:
|
W/m·k
|
LCV-23:
|
1.0
|
LCV-30:
|
1.0
|
LCV-45:
|
1.0
|
|
Name:
|
Thermal Conductive Silicone Film
|
|
Test Item:
|
Thermal Conductivity
|
|
Unit:
|
W/m·k
|
|
LCV-23:
|
1.0
|
|
LCV-30:
|
1.0
|
|
LCV-45:
|
1.0
|
High-performance thermal interface material engineered for superior heat conduction and electrical insulation.
The Thermal Conductive SIL PAD is a cloth-like material composed of silica gel and glass fiber. Designed for demanding electronic and electrical applications, it effectively bridges gaps between heating interfaces and heat dissipation components to ensure optimal thermal management.
| Test Item | Unit | LCV-23 | LCV-30 | LCV-45 |
|---|---|---|---|---|
| Color | - | Pink /Gray | Pink /Gray | Pink /Gray |
| Thickness | mm | 0.23±0.03 | 0.3±0.03 | 0.45±0.03 |
| Hardness | Shore AO | 85±5 | 85±5 | 85±5 |
| Specific gravity | g/cm3 | 1.7±0.1 | 1.7±0.1 | 1.7±0.1 |
| Breakdown Voltage | KV/mm | ≥5.0 | ≥5.0 | ≥5.0 |
| Temp resistance | ℃ | -50~200 | -50~200 | -50~200 |
| Flame | - | V-0 | V-0 | V-0 |
| Thermal conductivity | W/m·k | 1.0 | 1.0 | 1.0 |
