Product Details
|
Test Item:
|
Dielectric Constant
|
Unit:
|
1.2MHz
|
LC1001:
|
2.8
|
Name:
|
Thermal Conductive Silicone Adhesive
|
|
Test Item:
|
Dielectric Constant
|
|
Unit:
|
1.2MHz
|
|
LC1001:
|
2.8
|
|
Name:
|
Thermal Conductive Silicone Adhesive
|
LC1001 is a high-performance, semi-flowing heat-resistant silicone adhesive sealant. Engineered with specialized thermal powders, it offers exceptional conductivity and reliability for demanding electronic applications.
One component deethanol type
V0 Grade
White, Semiliquid
| Test Item | Unit | LC1001 Data |
|---|---|---|
| Density Relative | g/cm3 | 1.6~1.65 |
| Adhesion | Cps | 80000~90000 |
| Surface drying time | min | ≤10 |
| Full curing time | Days | 3~7 |
| Tensile Strength | MPa | ≥1.5 |
| Elongation | % | 200~400 |
| Hardness | Shore A | 35~45 |
| Thermal Conductivity | W/m·K | 1.0 |
| Dielectric strength | kV/mm | 20 |