Product Details
|
Name:
|
Thermally Conductive Ceramics
|
Test Item:
|
Thermal Expansivity (300-800℃)
|
Unit:
|
10-6℃-1
|
LT800:
|
3.2
|
Test Methods:
|
GB/T 5594.3
|
|
Name:
|
Thermally Conductive Ceramics
|
|
Test Item:
|
Thermal Expansivity (300-800℃)
|
|
Unit:
|
10-6℃-1
|
|
LT800:
|
3.2
|
|
Test Methods:
|
GB/T 5594.3
|
The LT800 is engineered using advanced ceramic material casting technology, delivering superior mechanical and thermal properties. Designed for high-reliability power semiconductor applications, it outperforms traditional alumina and aluminum nitride substrates.
| Test Item | Unit | LT800 | Test Method |
|---|---|---|---|
| Appearance / Color | - | Fine crystal/Gray | Visually |
| Specific Gravity | g/cm3 | 3.260 | GB/T 2413 |
| Thermal Conductivity (25℃) | W/m·K | 80 | ISO 22007-2 |
| Dielectric Constant | 1MHz | 8~10 | GB/T 5594.4 |
| Breakdown Voltage | KV/mm | ≥15 | GB/T 5593 |
| Flexural Strength | MPa | 800 | GB/T 5593 |
| Warpage | ‰ | ≤2 | - |
| Surface Roughness | μm | 0.2-0.6 | GB/T 6062 |
| Water Absorption | % | 0 | GB/T 3299 |
| Volume Resistivity (20℃) | Ω.cm | 7.08*1014 | GB/T 5594.5 |
| Thermal Expansivity (20-300℃) | 10-6℃-1 | 2.7 | GB/T 5594.3 |
| Thermal Expansivity (300-800℃) | 10-6℃-1 | 3.2 | GB/T 5594.3 |