Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com 86-755-29082440
products
products
Home > products > Thermally Conductive Ceramics > LT800 Superior Thermally Conductive Ceramics Silicon Nitride Ceramic Sheet Gray

LT800 Superior Thermally Conductive Ceramics Silicon Nitride Ceramic Sheet Gray

Product Details

Chat now
Highlight:

Superior Thermally Conductive Ceramics

,

Silicon Nitride Ceramic Sheet

,

Silicon Nitride Sheet Gray

Name:
Thermally Conductive Ceramics
Test Item:
Thermal Expansivity (300-800℃)
Unit:
10-6℃-1
LT800:
3.2
Test Methods:
GB/T 5594.3
Name:
Thermally Conductive Ceramics
Test Item:
Thermal Expansivity (300-800℃)
Unit:
10-6℃-1
LT800:
3.2
Test Methods:
GB/T 5594.3
LT800 Superior Thermally Conductive Ceramics Silicon Nitride Ceramic Sheet Gray
 

LT800 High-Performance Ceramic Substrate

The LT800 is engineered using advanced ceramic material casting technology, delivering superior mechanical and thermal properties. Designed for high-reliability power semiconductor applications, it outperforms traditional alumina and aluminum nitride substrates.

  • High Mechanical Strength: Approximately twice the bending strength of conventional substrates.
  • Superior Thermal Conductivity: More than three times the thermal conductivity of standard alternatives.
  • Electrical Reliability: High electrical insulation coefficient and thermal expansion coefficient matched to silicon.

Product Attributes

Material: Advanced Ceramic Casting
Color: Gray (Fine Crystal)
Application: Power Semiconductor Substrates

Technical Specifications

Test Item Unit LT800 Test Method
Appearance / Color - Fine crystal/Gray Visually
Specific Gravity g/cm3 3.260 GB/T 2413
Thermal Conductivity (25℃) W/m·K 80 ISO 22007-2
Dielectric Constant 1MHz 8~10 GB/T 5594.4
Breakdown Voltage KV/mm ≥15 GB/T 5593
Flexural Strength MPa 800 GB/T 5593
Warpage ‰ ≤2 -
Surface Roughness μm 0.2-0.6 GB/T 6062
Water Absorption % 0 GB/T 3299
Volume Resistivity (20℃) Ω.cm 7.08*1014 GB/T 5594.5
Thermal Expansivity (20-300℃) 10-6℃-1 2.7 GB/T 5594.3
Thermal Expansivity (300-800℃) 10-6℃-1 3.2 GB/T 5594.3