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Home > products > Thermal Potting Compound > LCF150Y Thermal Potting Compound Non Corrosive Low Viscosity For Electronic Sensors

LCF150Y Thermal Potting Compound Non Corrosive Low Viscosity For Electronic Sensors

Product Details

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F150Y Thermal Potting Compound

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Thermal Potting Compound Non Corrosive

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Thermal Potting Compound Low Viscosity

Name:
Thermal Potting Compound
Test Items:
Continuous Use Temp
LCF150Y:
-40~150℃
Test Method:
UL94
Name:
Thermal Potting Compound
Test Items:
Continuous Use Temp
LCF150Y:
-40~150℃
Test Method:
UL94
LCF150Y Thermal Potting Compound Non Corrosive Low Viscosity For Electronic Sensors
 

LCF150Y Thermal Conductive Potting Compound

A high-performance, low-viscosity two-component silicone potting material designed for superior thermal conductivity and electrical insulation.

Key Benefits

  • Excellent Thermal Management: High thermal conductivity (1.5 W/m.k).
  • Superior Protection: Resistant to high humidity, extreme temperatures, mechanical shock, and vibration.
  • Non-Corrosive: Safe for use on various sensitive electronic substrates.
  • Easy Processing: Low-viscosity with excellent fluidity and no small molecule emission during curing.

Target Applications

Ideal for driving power supplies, electronic sensors, and photovoltaic junction boxes.

Product Attributes

Material Type: Two-component Silicone
Flame Rating: V-0 (UL94)
Mixing Ratio: 1:1
Operating Temp: -40 to 150°C

Technical Specifications

Test Item LCF150Y Value Test Method
Appearance (Cured) Gray solid Visual
Thermal Conductivity 1.5±0.15 W/m.k ISO22007
Hardness 50±5 ShoreA ASTM D2240
Specific Gravity 2.5g/cm³ ±0.05 ASTM D792
Breakdown Voltage 15 KV/mm ASTM D149
Operable Time 60min/25°C ASTM C679