Product Details
|
Test Items:
|
Continuous Use Temp
|
A Part:
|
-40~150℃
|
B Part:
|
-40~150℃
|
Test Method:
|
UL94
|
Name:
|
Thermal Conductive Potting Compound
|
|
Test Items:
|
Continuous Use Temp
|
|
A Part:
|
-40~150℃
|
|
B Part:
|
-40~150℃
|
|
Test Method:
|
UL94
|
|
Name:
|
Thermal Conductive Potting Compound
|
A professional-grade, low-viscosity two-component silicone potting material engineered for superior thermal management and electrical insulation. Designed to protect sensitive electronic components from harsh environmental stressors.
| Test Item | Value | Test Method |
|---|---|---|
| Mixing Ratio | 1:1 | / |
| Thermal Conductivity | 0.8 ± 0.08 W/m.k | ISO22007 |
| Hardness | 50 ± 5 ShoreA | ASTM D2240 |
| Operable Time | 45 min / 25°C | ASTM C679 |
| Breakdown Voltage | 15 KV/mm | ASTM D149 |
| Tensile Strength | 0.80 MPa | ASTM D412 |
| Volume Resistivity | 1×10^14 Ω·cm | ASTM D257 |