Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com 86-755-29082440
products
products
Home > products > Thermal Potting Compound > LCF080Y Thermal Conductive Potting Compound Low Viscosity Two Component Silicone Potting Material

LCF080Y Thermal Conductive Potting Compound Low Viscosity Two Component Silicone Potting Material

Product Details

Chat now
Highlight:

Thermal Conductive Potting Compound

,

Low Viscosity Silicone Potting Material

,

Two Component Silicone Potting Material

Test Items:
Continuous Use Temp
A Part:
-40~150℃
B Part:
-40~150℃
Test Method:
UL94
Name:
Thermal Conductive Potting Compound
Test Items:
Continuous Use Temp
A Part:
-40~150℃
B Part:
-40~150℃
Test Method:
UL94
Name:
Thermal Conductive Potting Compound
LCF080Y Thermal Conductive Potting Compound Low Viscosity Two Component Silicone Potting Material
 

Thermal Conductive Potting Compound

A professional-grade, low-viscosity two-component silicone potting material engineered for superior thermal management and electrical insulation. Designed to protect sensitive electronic components from harsh environmental stressors.

Key Benefits

  • Excellent Thermal Conductivity: Efficiently dissipates heat to extend component lifespan.
  • Superior Protection: Guards against high humidity, extreme temperatures, mechanical shock, and vibration.
  • Non-Corrosive: Safe for use on various sensitive substrates.
  • High Fluidity: Ensures easy application and complete coverage of complex circuit boards.

Product Attributes

Material: Silicone (Two-Component)
Curing Appearance: Gray Solid
Flame Rating: V-0 (UL94)
Operating Temp: -40 to 150°C

Technical Specifications

Test Item Value Test Method
Mixing Ratio 1:1 /
Thermal Conductivity 0.8 ± 0.08 W/m.k ISO22007
Hardness 50 ± 5 ShoreA ASTM D2240
Operable Time 45 min / 25°C ASTM C679
Breakdown Voltage 15 KV/mm ASTM D149
Tensile Strength 0.80 MPa ASTM D412
Volume Resistivity 1×10^14 Ω·cm ASTM D257