Product Details
|
Name:
|
Thermally Conductive Potting Compound
|
Test Items:
|
Continuous Use Temp
|
A Part:
|
1:1
|
B Part:
|
1:1
|
Test Method:
|
UL94
|
Value:
|
-40~150℃
|
|
Name:
|
Thermally Conductive Potting Compound
|
|
Test Items:
|
Continuous Use Temp
|
|
A Part:
|
1:1
|
|
B Part:
|
1:1
|
|
Test Method:
|
UL94
|
|
Value:
|
-40~150℃
|
A high-performance, low-viscosity two-component silicone solution designed for superior protection and heat dissipation in electronic applications.
| Test Item | Value / Detail | Test Method |
|---|---|---|
| Appearance | A: White / B: Grey Fluid | Visual |
| Viscosity | 10000±1000 | ASTM D2857 |
| Mixing Ratio | 1:1 | - |
| Thermal Conductivity | 2.0±0.2W/m.k | ISO22007 |
| Hardness | 50±5 ShoreA | ASTM D2240 |
| Specific Gravity | 2.70g/cm3 ±0.05 | ASTM D792 |
| Tensile Strength | 0.85MPa | ASTM D412 |
| Volume Resistivity | 1.6×10^13 Ω·cm | ASTM D257 |
| Breakdown Voltage | 15KV/mm | ASTM D149 |
| Flame Rating | V-0 | UL94 |
| Use Temperature | -40~150℃ | - |