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Home > products > Thermal Potting Compound > LCF200Y 2.0 W/m·K Thermally Conductive Potting Compound For Electronics Substrates

LCF200Y 2.0 W/m·K Thermally Conductive Potting Compound For Electronics Substrates

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2.0 W/m·K Thermally Conductive Potting Compound

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Thermally Conductive Potting Compound For Electronics

Name:
Thermally Conductive Potting Compound
Test Items:
Continuous Use Temp
A Part:
1:1
B Part:
1:1
Test Method:
UL94
Value:
-40~150℃
Name:
Thermally Conductive Potting Compound
Test Items:
Continuous Use Temp
A Part:
1:1
B Part:
1:1
Test Method:
UL94
Value:
-40~150℃
LCF200Y 2.0 W/m·K Thermally Conductive Potting Compound For Electronics Substrates
 

Thermal Conductive Potting Compound

A high-performance, low-viscosity two-component silicone solution designed for superior protection and heat dissipation in electronic applications.

Key Benefits:

  • Excellent Thermal Management: High thermal conductivity for efficient heat transfer.
  • Superior Protection: Resists high humidity, extreme temperatures, mechanical shock, and vibration.
  • Non-Corrosive: Safe for use on sensitive electronic substrates.
  • Versatile Application: Ideal for power supplies, sensors, and photovoltaic junction boxes.

Technical Specifications

Test Item Value / Detail Test Method
Appearance A: White / B: Grey Fluid Visual
Viscosity 10000±1000 ASTM D2857
Mixing Ratio 1:1 -
Thermal Conductivity 2.0±0.2W/m.k ISO22007
Hardness 50±5 ShoreA ASTM D2240
Specific Gravity 2.70g/cm3 ±0.05 ASTM D792
Tensile Strength 0.85MPa ASTM D412
Volume Resistivity 1.6×10^13 Ω·cm ASTM D257
Breakdown Voltage 15KV/mm ASTM D149
Flame Rating V-0 UL94
Use Temperature -40~150℃ -