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                                                                                                                                                            Silicone Potting Material Low Viscosity, Electrical Insulation Silicone Potting Material, Two Component Silicone Potting Material
                      

Name:	Silicone Potting Material	Test Items:	Continuous Use Temp
A Part:	-40~150℃	B Part:	-40~150℃
Test Method:	UL94

Name:	Silicone Potting Material
Test Items:	Continuous Use Temp
A Part:	-40~150℃
B Part:	-40~150℃
Test Method:	UL94

LCF300Y Two Component Silicone Potting Material Low Viscosity For Electrical Insulation

Thermal Conductive Potting Compound

A high-performance, low-viscosity two-component silicone potting material engineered for superior thermal management and electrical insulation.

Key Benefits:

Excellent Thermal Conductivity: Efficiently dissipates heat from sensitive components.
Robust Protection: Shields electronics from high humidity, extreme temperatures, mechanical shock, and vibration.
Superior Fluidity: Ensures seamless contact with heat-generating components, eliminating thermal resistance.
Safe & Reliable: Non-corrosive to substrates and produces no small molecules during the curing process.

Target Applications: Driving power supplies, electronic sensors, and photovoltaic junction boxes.

Product Attributes

Material Type: Two-component Silicone

Curing State: Gray Solid

Mixing Ratio: 1:1

Flame Rating: V-0 (UL94)

Technical Specifications

Test Item	Value	Test Method
Thermal Conductivity	3.0±0.3 W/m.k	ISO22007
Hardness	50±5 ShoreA	ASTM D2240
Specific Gravity	3.01g/cm3 ±0.05	ASTM D792
Tensile Strength	1.20 MPa	ASTM D412
Volume Resistivity	1×10^13 Ω·cm	ASTM D257
Breakdown Voltage	10 KV/mm	ASTM D149
Operating Temp	-40~150℃	-
Operable Time	45 min (25℃)	ASTM C679

Tags:

Thermal Conductive Potting Compound,

Silicone Potting Material,

Potting Compound For Electronics

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