2W/m·K High Compressibility Thermal Gap Filler Customized For Thermal Management Solutions

Product Description:

The Thermal Pad is an essential component designed to enhance heat dissipation in a wide range of electronic devices and applications. Engineered with precision, this Thermal Conductive Pad serves as an efficient Thermal Gap Filler, bridging the space between heat-generating components and heat sinks or other cooling solutions. Its primary function is to improve thermal conductivity, ensuring that excess heat is effectively transferred away from sensitive components, thereby maintaining optimal operating temperatures and enhancing the overall reliability and performance of electronic systems.

One of the standout features of this Thermal Pad is its specific gravity of 2.36 G/cc, which reflects its dense and robust composition. This density is a critical factor in providing excellent thermal conductivity, measured at 2.0 W/mK. Such a thermal conductivity rating means that the Thermal Conductive Pad can efficiently conduct heat, making it an ideal solution for applications where managing heat is crucial. Whether used in computers, power supplies, LED lighting, or other electronic assemblies, this Thermal Pad ensures effective heat transfer, minimizing the risk of overheating and potential damage to components.

In addition to its impressive thermal properties, the Thermal Pad boasts an operating temperature range from -40°C to 150°C. This wide temperature tolerance makes it suitable for use in diverse environments, from cold storage facilities to high-temperature industrial settings. The ability to maintain performance across such a broad temperature spectrum ensures that the Thermal Conductive Pad remains reliable and effective, even under harsh conditions. This versatility makes it a preferred choice for engineers and designers seeking dependable thermal management solutions.

Another significant advantage of this Thermal Pad is its reusability. Unlike some thermal interface materials that are single-use, this Thermal Conductive Pad can be removed and reapplied multiple times without losing its thermal performance or physical integrity. This feature not only provides cost savings over time but also facilitates easier maintenance and upgrades of electronic devices. Users can confidently replace components or adjust thermal management setups without worrying about compromising the thermal interface quality.

The application of the Thermal Pad as a Thermal Gap Filler is straightforward and user-friendly. It conforms easily to irregular surfaces, filling microscopic gaps and air pockets that would otherwise impede heat transfer. This conformability ensures a tight fit between components, maximizing contact area and enhancing heat conduction efficiency. The pad's flexibility and durability further contribute to its effectiveness, allowing it to withstand mechanical stresses and vibrations commonly encountered in electronic assemblies.

In summary, the Thermal Pad is a high-performance Thermal Conductive Pad designed to meet the demanding requirements of modern electronic thermal management. With a specific gravity of 2.36 G/cc and a thermal conductivity of 2.0 W/mK, it provides excellent heat transfer capabilities. Its wide operating temperature range from -40°C to 150°C ensures reliable performance in various environments, while its reusability adds value through cost savings and ease of maintenance. As a versatile Thermal Gap Filler, this Thermal Pad offers a practical and efficient solution for enhancing the thermal stability and longevity of electronic devices.

Features:

• Product Name: Thermal Pad
• Application: Heat Dissipation Between Electronic Components And Heat Sinks
• Thermal Conductivity: 2.0 W/mK for efficient heat transfer
• Operating Temperature Range: -40°C to 150°C
• Dielectric Strength: 10 KV/mm ensuring electrical insulation
• Reusability: Yes, can be reused multiple times
• Type: Thermal Conductive Sheet designed for optimal performance
• Also known as Thermal Conductive Pad and Heat Dissipation Pad

Technical Parameters:

Applications:

The Union Tenda LC200 Thermal Conductive Pad is an essential Thermal Interface Material designed to efficiently transfer heat in various electronic and industrial applications. With a thermal conductivity of 2.0W/mK and a thermal resistance of 0.921 °C·in²/W, this Thermal Conductive Sheet ensures optimal heat dissipation, protecting sensitive components from overheating and enhancing the overall performance and longevity of devices.

Originating from China, the LC200 model is RoHS and REACH certified, guaranteeing compliance with international environmental and safety standards. Its dielectric strength of 10 KV/mm makes it an excellent insulator, suitable for use in electrical and electronic assemblies where electrical isolation is critical alongside thermal management. The specific gravity of 2.36 G/cc contributes to the pad’s durability and stability under various operating conditions.

Ideal for use in consumer electronics, such as laptops, smartphones, and LED lighting, Union Tenda’s Thermal Conductive Pad serves as a reliable Thermal Interface Material between heat-generating components and heat sinks. Additionally, it is widely used in automotive electronics, power supplies, and telecommunications equipment, where efficient thermal management is crucial. Its reusability feature allows for easy maintenance and replacement without compromising performance.

Manufactured with precision and supplied in packaging sizes of 24*22*6 cm or 42*22*11 cm cartons, the LC200 is available at competitive pricing ranging from 0.01 to 10 USD per unit. With a minimum order quantity of 1000 pieces and a supply ability of 2 tons per day, Union Tenda ensures quick delivery times of 3 to 5 days, making it highly suitable for large-scale industrial and commercial projects. Payment terms are flexible with TT options available to facilitate smooth transactions.

In summary, the Union Tenda LC200 Thermal Conductive Pad is a versatile Thermal Interface Material perfect for applications requiring efficient heat transfer and electrical insulation. Its excellent thermal conductivity, robust dielectric strength, and reusability make it an indispensable Thermal Conductive Sheet for diverse sectors including electronics manufacturing, automotive, and telecommunications. Whether for OEM production or replacement parts, this thermal conductive pad offers reliable performance and rapid delivery, meeting the demands of modern thermal management solutions.