2W/M·K Thermal Conductive Pad 0.5mm - 30.0mm Thickness For Thermal Management

Product Description:

The Thermal Conductive Pad is an essential component designed to enhance heat dissipation in electronic devices by efficiently transferring heat between electronic components and heat sinks. This high-performance Thermal Gap Filler is engineered to provide reliable thermal management solutions, ensuring the longevity and optimal performance of sensitive electronic parts. With a thickness range spanning from 0.5mm to 30.0mm, this versatile Heat Dissipation Pad can accommodate various application requirements, offering flexibility in design and installation.

One of the standout features of this Thermal Conductive Pad is its excellent thermal resistance value of 0.921 °C·in²/W, which demonstrates its superior ability to conduct heat away from critical components. By minimizing thermal resistance, it effectively reduces the operating temperature of electronic devices, preventing overheating and potential failure. This makes the Thermal Gap Filler ideal for use in a wide range of applications, including power supplies, LED lighting, telecommunications equipment, and computer hardware, where efficient heat dissipation is crucial.

The Thermal Conductive Pad is also designed to maintain optimal performance under compression rates ranging from 15% to 30%. This compression capability ensures that the pad conforms closely to the surfaces of electronic components and heat sinks, filling microscopic gaps and irregularities. As a result, it maximizes the contact area, improving thermal conductivity and enhancing heat transfer efficiency. The pad’s ability to compress without losing integrity guarantees consistent performance over time, even in demanding operating conditions.

Safety is another critical aspect of this Heat Dissipation Pad. It boasts a flame rating of 94V-0, indicating its compliance with stringent flammability standards. This rating ensures that the Thermal Gap Filler is flame retardant, providing an added layer of protection in electronic assemblies where fire hazards must be minimized. The 94V-0 flame rating reflects the product's suitability for use in environments requiring high safety standards, offering peace of mind to manufacturers and end-users alike.

In addition to its technical performance, this Thermal Conductive Pad is easy to handle and install. Its flexible nature allows it to be cut or shaped to fit specific component layouts, making it a practical choice for customized thermal management solutions. The pad’s consistent thickness and uniform structure ensure reliable thermal performance throughout its lifespan, contributing to the overall durability and efficiency of electronic devices.

Overall, this Thermal Gap Filler is a highly effective Heat Dissipation Pad designed to meet the thermal management challenges of modern electronics. Its combination of a broad thickness range, low thermal resistance, appropriate compression rate, and excellent flame retardancy makes it an ideal solution for improving heat transfer between electronic components and heat sinks. Whether used in consumer electronics, industrial equipment, or advanced technological applications, this Thermal Conductive Pad provides dependable, long-lasting thermal performance, enhancing device reliability and safety.

To summarize, the Thermal Conductive Pad offers:

• A thickness range from 0.5mm to 30.0mm, providing adaptability for various applications.
• Thermal resistance of 0.921 °C·in²/W, ensuring efficient heat transfer.
• Compression rates between 15% and 30%, allowing excellent conformity and contact.
• A flame rating of 94V-0, guaranteeing high safety standards.
• Ideal use as a Thermal Gap Filler to enhance heat dissipation between electronic components and heat sinks.

Incorporating this Heat Dissipation Pad into your thermal management system will significantly improve the performance and reliability of your electronic devices by effectively managing heat and providing robust safety features.

Features:

• Product Name: Thermal Pad
• Material: Silicone Rubber
• Thermal Conductivity: 2.0W/mK for efficient heat transfer
• Operating Temperature Range: -40°C to 150°C
• Application: Heat dissipation between electronic components and heat sinks
• Flame Rating: 94V-0 for enhanced safety
• High-performance Thermal Conductive Sheet for reliable thermal management
• Durable Thermal Conductive Pad suitable for various electronic devices

Technical Parameters:

Applications:

The Union Tenda LC200 Thermal Conductive Pad, manufactured in China, is a high-performance Thermal Interface Material designed to provide efficient heat dissipation between electronic components and heat sinks. With a thermal conductivity of 2.0W/mK and a thermal resistance of 0.921 °C·in²/W, this thermal conductive pad ensures optimal thermal management in various electronic applications, maintaining device stability and longevity.

This thermal conductive pad is widely used in multiple application occasions and scenarios, especially in electronics where effective heat transfer is crucial. It is ideal for use in computer hardware such as CPUs, GPUs, and power modules, where it helps to prevent overheating by efficiently transferring heat from the component to the heat sink. Additionally, it is suitable for LED lighting systems, enhancing the thermal performance and extending the lifespan of LED chips.

In telecommunications, the Union Tenda LC200 Thermal Interface Material is employed in base stations and network equipment to manage heat generated by high-performance processors and power amplifiers. Its excellent dielectric strength of 10 KV/mm also makes it safe for use in sensitive electronic assemblies requiring electrical insulation alongside thermal conductivity.

The thermal pad’s operating temperature range of -40°C to 150°C ensures reliability in extreme environmental conditions, making it suitable for automotive electronics, industrial machinery, and outdoor equipment. The product is RoHS and REACH certified, guaranteeing compliance with environmental and safety standards, which is vital for manufacturers and end-users concerned with eco-friendly materials.

Available with a minimum order quantity of 1000 pieces, Union Tenda offers competitive pricing from 0.01 to 10 USD per unit, depending on specifications and order volume. Packaged efficiently in cartons sized 24*22*6 cm or 42*22*11 cm, the thermal conductive pads are easy to store and transport. With a supply ability of 2 tons per day and a delivery time of just 3 to 5 days, Union Tenda ensures timely fulfillment of bulk orders. Payment terms are typically via TT, providing secure and convenient transaction options.

Overall, the Union Tenda LC200 Thermal Conductive Pad is an excellent thermal interface material choice for electronics manufacturers looking to enhance heat dissipation, improve device performance, and ensure long-term reliability across a broad range of industrial and consumer applications.