2W/m·K High Insulation Thermal Conductive Pad For Thermal Management Solutions

2W/M.K High Insulation Thermal Conductive Pad For Thermal Management Solutions

Product Description:

The Thermal Pad is a high-performance thermal interface material designed to enhance heat dissipation between electronic components and heat sinks. Engineered to provide efficient thermal conductivity, this Thermal Conductive Pad plays a crucial role in maintaining optimal operating temperatures for various electronic devices, thereby improving their reliability and longevity. Available in a versatile thickness range from 0.5mm to 30.0mm, the Thermal Pad can accommodate different gap sizes and uneven surfaces, making it an ideal Thermal Gap Filler for a wide array of applications.

One of the standout features of this Thermal Conductive Pad is its exceptional operating temperature range, which spans from -40°C to 150°C. This broad range ensures that the Thermal Pad performs reliably in both extreme cold and high-temperature environments, making it suitable for use in diverse industries such as telecommunications, automotive electronics, power supplies, and consumer electronics. The ability to maintain consistent thermal performance under varying temperature conditions helps prevent overheating and potential component failure.

The Thermal Pad is specifically designed to facilitate efficient heat transfer between electronic components and their corresponding heat sinks. By filling the microscopic air gaps that naturally occur due to surface irregularities, the Thermal Gap Filler minimizes thermal resistance and maximizes heat dissipation. This improved thermal interface significantly reduces the risk of thermal throttling and enhances the overall efficiency of electronic devices, ensuring stable operation even under heavy workloads.

In addition to its excellent thermal conductivity, the Thermal Pad boasts a flame rating of 94V-0, highlighting its superior safety standards. This flame retardant rating indicates that the material is self-extinguishing and resists ignition, providing an added layer of protection against fire hazards in electronic assemblies. Such safety features are particularly important in applications where thermal management materials are exposed to high temperatures and electrical currents.

Manufactured with high-quality materials, the Thermal Conductive Pad offers a balance of softness and resilience, allowing it to conform easily to surfaces while maintaining its structural integrity over time. This ensures a stable and durable thermal interface that does not degrade or lose effectiveness during extended use. Furthermore, the ease of installation and excellent electrical insulation properties make the Thermal Pad a preferred choice for engineers and technicians seeking reliable thermal management solutions.

The wide thickness range of 0.5mm to 30.0mm provides flexibility in design and application, enabling users to select the precise thickness needed to optimize thermal performance and mechanical fit. Whether filling narrow gaps in compact electronic assemblies or larger spaces in industrial equipment, this Thermal Conductive Pad adapts seamlessly to various configurations. Its versatility makes it an indispensable component in the thermal management toolkit.

In summary, the Thermal Pad is an essential Thermal Gap Filler that combines superior thermal conductivity, wide temperature tolerance, and robust safety features to deliver outstanding heat dissipation performance. Its flame rating of 94V-0 ensures compliance with stringent safety standards, while its adaptable thickness range caters to a multitude of electronic cooling requirements. By incorporating this Thermal Conductive Pad into your thermal management strategy, you can significantly enhance the performance and durability of your electronic devices, ensuring they operate efficiently and safely under challenging conditions.

Features:

• Product Name: Thermal Pad
• Application: Heat dissipation between electronic components and heat sinks
• Operating Temperature Range: -40°C to 150°C
• Thermal Resistance: 0.921 °C·in²/W
• Compression Rate: 15%~30%
• Material Type: Silicon Insulation Pads
• Features ultra-soft heat conductive pad for enhanced flexibility
• Acts as an effective Thermal Interface Material
• Serves as a Heat Dissipation Pad and Thermal Conductive Sheet
• Flexible Heat Dissipation Pad suitable for various electronic applications
• Also known as Heat Sink Pad, ideal for improving thermal management

Technical Parameters:

Applications:

The Union Tenda LC200 Thermal Pad is an advanced thermal interface material designed to efficiently dissipate heat between electronic components and heat sinks. Manufactured in China, this high-quality thermal conductive pad is certified with RoHS and REACH, ensuring environmental safety and compliance with international standards. With a specific gravity of 2.36 g/cc and an operating temperature range from -40°C to 150°C, this thermal conductive sheet is ideal for a wide variety of electronic applications requiring reliable heat management.

One of the primary applications of the Union Tenda LC200 Thermal Pad is in electronic devices where effective heat dissipation is crucial. It serves as a thermal interface material that bridges the gap between heat-generating components, such as CPUs, GPUs, power transistors, and LED modules, and their corresponding heat sinks. By filling microscopic air gaps and irregular surfaces, this thermal pad ensures maximum thermal conductivity, preventing overheating and enhancing device performance and longevity.

The thickness range of 0.5mm to 30.0mm allows for flexible customization depending on the specific application requirements, making the LC200 thermal conductive sheet suitable for use in consumer electronics, telecommunications equipment, automotive electronics, and industrial machinery. Its flame rating of 94V-0 further guarantees safety in environments where fire resistance is essential.

Union Tenda offers this thermal conductive pad with a minimum order quantity of 1000 units, catering to both small and large scale manufacturing needs. The packaging is designed for easy handling and storage, with carton sizes of 24*22*6 cm or 42*22*11 cm. With a supply ability of 2 tons per day and a delivery time of just 3 to 5 days, customers can expect timely fulfillment of orders. Pricing ranges from 0.01 to 10 USD per unit, making it a cost-effective solution for thermal management. Payment is conveniently handled via TT, supporting smooth international transactions.

In summary, the Union Tenda LC200 Thermal Conductive Pad is an excellent choice for engineers and manufacturers looking for a reliable, certified, and versatile thermal interface material. It is engineered to optimize heat transfer, protect sensitive electronic components, and ensure stable operation across diverse thermal management scenarios.