Product Details
Place of Origin: Guangdong,China
Brand Name: Union Tenda
Certification: RoHS,UL,Reach
Model Number: LC150
Payment & Shipping Terms
Minimum Order Quantity: 100pcs
Price: 0.01~10USD
Packaging Details: 42*22*11cm Cartons
Delivery Time: 7 days
Payment Terms: TT
Supply Ability: 2 Tons/day
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Key Words:
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Thermal Silicone Pad , Silicone Thermal Interface Material, Heat Sink Pad, Ultra-soft Heat Conductive Pad , Flexible Heat Dissipation Pad, Thermal Conductive Silicone Pad
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Material:
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Silicone
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Dielectricstrength:
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10 KV/mm
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Thermal Conductivity:
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1.5 W/mK
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Electricalinsulation:
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Yes
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Thickness Range:
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0.20 Mm~5.0mm
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Specific Gravity:
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1.9 G/cm3
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Flammabilityrating:
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UL94 V-0
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Size:
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Customized
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Name:
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Thermal Conductive Pad
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Key Words:
|
Thermal Silicone Pad , Silicone Thermal Interface Material, Heat Sink Pad, Ultra-soft Heat Conductive Pad , Flexible Heat Dissipation Pad, Thermal Conductive Silicone Pad
|
|
Material:
|
Silicone
|
|
Dielectricstrength:
|
10 KV/mm
|
|
Thermal Conductivity:
|
1.5 W/mK
|
|
Electricalinsulation:
|
Yes
|
|
Thickness Range:
|
0.20 Mm~5.0mm
|
|
Specific Gravity:
|
1.9 G/cm3
|
|
Flammabilityrating:
|
UL94 V-0
|
|
Size:
|
Customized
|
|
Name:
|
Thermal Conductive Pad
|
1.5 W/MK Ultra-Soft Thermal Silicone Pad With Good Insulation For Heat Sink
The Thermal Conductive Pad is an essential component designed to efficiently manage heat dissipation in electronic devices. With a specific gravity of 1.9 G/cm³, this Thermal Silicone Pad offers an optimal balance between density and flexibility, ensuring excellent thermal conductivity while maintaining a soft and pliable texture.
Its primary application is as a Thermal Interface Material placed between critical components such as chips, processors, storage devices, and their corresponding heat sinks or casings. This placement helps to bridge microscopic gaps and irregularities, enhancing heat transfer and preventing overheating, which can lead to improved device performance and longevity.
| Parameter | Specification |
|---|---|
| Flame Rating | UL 94 V-0 (E331100) |
| Material | Silicone |
| Color | Grayish White / Pink / Blue |
| Thermal Conductivity | 1.5 W/mK |
| Thickness Range | 0.20 mm ~ 5.0 mm |
| Dimensions | 200 mm x 400 mm or Customization |
| Materials | Ceramic Filled Silicone Elastomer |
| Dielectric Strength | 10 KV/mm |
The Union Tenda LC200 Thermal Silicone Pad is an advanced Thermal Interface Material designed to meet the demanding needs of modern electronics and industrial applications. Manufactured from ceramic filled silicone elastomer, this premium quality Heat Dissipation Pad offers excellent thermal conductivity and flexibility.
Ideal for use as a Thermal Gap Filler, the Union Tenda LC200 pad effectively bridges uneven gaps between heat-generating components and cooling solutions in various applications including servers, laptops, automotive electronics, and industrial equipment.
For professionals and manufacturers looking to evaluate the Thermal Conductive Pad before committing to bulk orders, free samples are available. This allows thorough testing to ensure compatibility with specific devices and thermal management needs.