1.5W/m·K Untra Soft Thermal Conductive Silicone Pad For Laptop / Tablet / PC Server

1.5W/M.K Untra-Soft Thermal Conductive Silicone Pad For Laptop, Tablet And PC Server

Product Description:

The Thermal Pad is an advanced heat dissipation solution designed to enhance the thermal management of electronic devices. Manufactured from high-quality silicone material, this pad serves as an effective thermal interface material between critical components such as chips, processors, storage devices, and their corresponding heat sinks or casings. Its primary function is to fill the microscopic gaps that naturally occur between these surfaces, thereby improving heat transfer efficiency and ensuring optimal performance and longevity of electronic equipment.

One of the standout features of this Thermal Pad is its exceptional flame retardant capability, certified with a Flame Rating of UL 94 V-0 (E331100). This rating guarantees that the material is highly resistant to ignition and self-extinguishes quickly in case of fire, making it a safe choice for use in sensitive and high-risk electronic environments. The ability to meet such stringent safety standards adds an extra layer of reliability for manufacturers and end-users alike.

Available in a versatile thickness range from 0.20 mm to 5.0 mm, this heat dissipation pad offers flexibility to accommodate various application requirements. Whether the gap between the heat source and the heat sink is minimal or substantial, the Thermal Pad can be selected in the appropriate thickness to ensure optimal contact and thermal conductivity. This wide thickness range makes it an ideal thermal gap filler for a broad spectrum of devices and configurations.

The silicone composition of the Thermal Pad is particularly advantageous due to its inherent properties such as excellent thermal conductivity, electrical insulation, and mechanical stability. Silicone is known for its ability to maintain flexibility and resilience across a wide temperature range, which helps the pad conform perfectly to uneven surfaces without losing its shape or effectiveness over time. This results in sustained thermal performance and protection of sensitive components.

In addition to its technical performance, the product is also customer-friendly. A free sample is available, allowing potential users to evaluate the pad’s compatibility and performance in their specific applications before making a purchase decision. This sample offering reflects confidence in the product’s quality and effectiveness as a heat dissipation pad and thermal gap filler.

The primary application of this Thermal Pad is as a thermal interface material. It is strategically placed between heat-generating components—such as microprocessors, integrated circuits, or storage devices—and their heat sinks or casing structures. By eliminating air gaps, which are poor conductors of heat, the Thermal Pad significantly enhances heat dissipation efficiency. This improved thermal management helps prevent overheating, thereby enhancing device reliability, performance, and lifespan.

In summary, the Thermal Pad is a high-performance, UL 94 V-0 flame-rated silicone solution designed for effective heat dissipation. Its wide thickness range from 0.20 mm to 5.0 mm allows it to serve as an excellent thermal gap filler in various electronic applications. The provision of a free sample facilitates easy assessment and integration into diverse thermal management systems. Whether used between chips, processors, storage devices, and heat sinks or casings, this heat dissipation pad ensures superior thermal conductivity, safety, and durability, making it an indispensable component for modern electronic thermal solutions.

Features:

• Product Name: Thermal Pad
• Electrical Insulation: Yes
• Thickness Range: 0.20 mm to 5.0 mm
• Application: Thermal interface material between chip, processor, storage device, and heat sink or casing
• Hardness: Shore 00 50
• Thermal Conductivity: 1.5 W/mK
• Functions as a Thermal Conductive Pad and Thermal Gap Filler
• Efficient Thermal Conductive Pad for improved heat dissipation

Technical Parameters:

Applications:

The Union Tenda LC200 Thermal Pad is an advanced Thermal Interface Material designed to efficiently manage heat dissipation in a wide range of electronic applications. Originating from China and certified by RoHS and REACH, this product ensures compliance with international environmental and safety standards, making it an ideal choice for manufacturers and engineers focused on sustainable and reliable thermal management solutions.

One of the primary application occasions for the Union Tenda LC200 Thermal Pad is in electronic devices where thermal gap filling is critical. As a Thermal Gap Filler, it effectively bridges the heat-generating components and heat sinks, enhancing thermal conductivity and preventing overheating. This makes it perfect for use in high-performance CPUs, GPUs, power modules, LED lighting systems, and other electronic assemblies where efficient heat transfer is essential for optimal performance and longevity.

The Thermal Pad’s thickness range, from 0.20 mm to 5.0 mm, offers versatility in accommodating various gap sizes and surfaces. Available in grayish white, pink, and blue colors, the product can be tailored to specific aesthetic or identification requirements. Its UL94 V-0 flammability rating guarantees superior fire resistance, adding an extra layer of safety in environments with stringent fire protection standards. Furthermore, the electrical insulation property of the Union Tenda LC200 ensures that it not only conducts heat efficiently but also prevents electrical short circuits, making it highly suitable for sensitive electronic components.

With a supply ability of 2 tons per day and a minimum order quantity of 1000 units, Union Tenda is well-equipped to meet both small and large-scale production needs. The product is competitively priced between 0.01 and 10 USD, catering to various budget requirements without compromising quality. Packaged securely in cartons sized 24*22*6 cm or 42*22*11 cm, the Thermal Pads are easy to store and transport. Delivery times are swift, typically within 3 to 5 days, ensuring timely availability for urgent manufacturing schedules.

Payment terms through TT add convenience for international buyers, and the availability of free samples allows potential customers to evaluate the product’s performance before committing to bulk purchases. Whether used in consumer electronics, industrial equipment, or automotive applications, the Union Tenda LC200 Thermal Interface Material and Thermal Gap Filler provide a reliable, high-quality solution for effective thermal management across diverse scenarios.