2W/m·K Low Volatility Thermal Gap Filler Pad To Optimize Heat Transfer Between Electronic Components And Heat Sinks

Product Description:

The Thermal Pad is an essential component designed to enhance the efficiency of heat transfer between electronic devices and their heat sinks or cooling systems. Engineered to meet the demanding requirements of modern electronics, this Thermal Conductive Pad plays a crucial role in maintaining optimal operating temperatures, thereby ensuring the reliability and longevity of sensitive components. With its superior thermal performance, the Thermal Pad is an ideal solution for applications requiring effective heat management.

One of the standout features of this Heat Dissipation Pad is its impressive operating temperature range, which spans from -40°C to 150°C. This wide range allows the Thermal Pad to perform reliably under extreme temperature conditions, making it suitable for use in various environments, from industrial machinery to consumer electronics. Whether exposed to freezing cold or high heat, the pad maintains its structural integrity and thermal conductivity, ensuring consistent performance.

The Thermal Pad boasts a density of 2.36 g/cm³, which contributes to its robust physical properties and durability. This density ensures that the pad is sufficiently dense to provide excellent contact between surfaces, minimizing thermal resistance. As a result, the Heat Dissipation Pad can efficiently transfer heat away from critical components, preventing overheating and potential damage. The density also supports the pad’s mechanical stability, allowing it to conform to uneven surfaces while maintaining effective thermal contact.

Safety and compliance are paramount in electronic components, and this Thermal Conductive Pad meets stringent flame retardant standards with a flame rating of 94V-0. This certification indicates that the pad is highly resistant to ignition and will self-extinguish quickly if exposed to fire, reducing the risk of fire hazards in electronic assemblies. This flame rating adds an extra layer of safety, making the Thermal Pad suitable for use in applications where fire safety is a concern.

Thermal conductivity is a critical parameter for any heat management material, and this Heat Dissipation Pad excels in this area with a thermal conductivity rating of 2.0 W/mK. This means the pad can effectively conduct heat away from hot components, facilitating faster heat dissipation and improved cooling efficiency. The high thermal conductivity helps maintain lower operating temperatures for electronic devices, which in turn enhances performance and extends the lifespan of the components.

The Thermal Pad is easy to install and can be cut to size, making it versatile for a variety of applications. It provides excellent electrical insulation while allowing heat to pass through, making it ideal for use in CPUs, GPUs, power transistors, and other heat-generating electronic parts. Its flexibility ensures that it can fill gaps and imperfections between surfaces, maximizing the contact area and optimizing thermal transfer.

In summary, the Thermal Conductive Pad is a high-performance Heat Dissipation Pad that combines excellent thermal conductivity, mechanical strength, and safety features. With an operating temperature range of -40°C to 150°C, a density of 2.36 g/cm³, a flame rating of 94V-0, and thermal conductivity of 2.0 W/mK, it is engineered to meet the thermal management needs of a wide range of electronic applications. Whether you are looking to improve heat dissipation in consumer electronics, industrial equipment, or automotive systems, this Thermal Pad offers reliable and efficient thermal management to protect your valuable components and ensure optimal device performance.

Features:

• Product Name: Thermal Pad
• High Thermal Conductivity: 2.0W/mK for efficient heat dissipation
• Density: 2.36 G/cm³ ensuring stable and consistent performance
• Specific Gravity: 2.36 G/cc for reliable material quality
• Hardness: Shore 00 60 providing optimal softness and flexibility
• Excellent Thermal Interface Material for improved device cooling
• Reliable Thermal Conductive Pad suitable for various electronic applications

Technical Parameters:

Applications:

The Union Tenda LC200 Thermal Pad is a high-performance thermal conductive sheet designed to efficiently manage heat dissipation in various electronic devices. With its excellent thermal conductivity of 2.0W/mK and low thermal resistance of 0.921 °C·in²/W, this thermal conductive pad ensures optimal heat transfer between components, preventing overheating and enhancing device longevity. Manufactured in China and certified by RoHS and REACH, the LC200 meets stringent environmental and safety standards, making it ideal for global applications.

Thanks to its versatile thickness range from 0.5mm to 30.0mm and a density of 2.36 G/cm³, the LC200 thermal gap filler can be tailored to fill uneven surfaces and gaps between heat-generating components and heat sinks. This adaptability makes it perfect for use in various application occasions, including consumer electronics, automotive electronics, LED lighting, power supplies, and telecommunications equipment. Whether you are designing laptops, smartphones, gaming consoles, or industrial machinery, this thermal pad provides reliable thermal management solutions.

In manufacturing scenarios where rapid turnaround is critical, Union Tenda offers a robust supply ability of 2 tons per day, with a minimum order quantity of 1000 pieces. The product is competitively priced between 0.01 to 10 USD depending on specifications and packaging options. Packaged carefully in cartons sized 24*22*6 cm or 42*22*11 cm, the thermal conductive sheets are protected during transportation and storage. Delivery times are efficient, typically ranging from 3 to 5 days, with payment terms via TT to facilitate smooth business transactions.

Application scenarios for the LC200 thermal gap filler include use in high-power LED modules, where heat dissipation is critical to maintain brightness and lifespan. It is also widely used in power amplifiers, automotive control units, and battery packs, where thermal management directly impacts performance and safety. The thermal conductive pad is ideal for filling air gaps in CPUs, GPUs, and other semiconductor devices, ensuring enhanced reliability and efficiency under demanding operating conditions.

Overall, the Union Tenda LC200 thermal pad is an indispensable component for engineers and manufacturers seeking a reliable thermal interface material. Its combination of high thermal conductivity, customizable thickness, environmental compliance, and rapid supply capability makes it suitable for a wide range of industrial and consumer applications. Whether used as a thermal conductive sheet, thermal conductive pad, or thermal gap filler, the LC200 delivers superior heat dissipation and product protection in diverse operating environments.