2 W/m·K Silicone Heat Dissipation Pad Customized For Electronic Devices

Product Description:

The Thermal Pad is an advanced Thermal Interface Material designed to provide exceptional heat dissipation and reliable performance in various electronic applications. Engineered as a Thermal Gap Filler, this product effectively bridges the microscopic air gaps between heat-generating components and heat sinks, ensuring optimal thermal conductivity and enhanced device longevity. Its superior composition allows it to conform perfectly between uneven surfaces, making it an ideal solution for managing heat in CPUs, GPUs, power modules, and other electronic devices.

One of the key features of this Thermal Pad is its excellent compression rate, ranging from 15% to 30%. This flexibility ensures that the pad can be easily compressed to fill gaps of varying sizes without losing its structural integrity. By adapting to different thicknesses and surface irregularities, it maintains consistent contact between components, thereby minimizing thermal resistance and maximizing heat transfer efficiency. This compression capability makes it particularly useful in environments where components undergo thermal cycling or mechanical stress.

In terms of thermal performance, this Thermal Interface Material boasts a low thermal resistance of 0.921 °C·in²/W. This metric indicates its ability to conduct heat effectively from the source to the heat sink, helping to prevent overheating and potential damage to sensitive electronic parts. The low thermal resistance is a testament to the high-quality materials and meticulous manufacturing processes involved, guaranteeing reliable and stable performance across a wide range of operating conditions.

The Thermal Pad also features a specific gravity of 2.36 G/cc, which reflects its density and material composition. This specific gravity ensures that the pad maintains a robust and durable structure while remaining flexible enough to serve as an efficient Thermal Gap Filler. The balance between density and elasticity is crucial for maintaining consistent thermal conductivity and mechanical resilience over extended periods of use.

Another significant advantage of this Thermal Interface Material is its reusability. Unlike many other thermal compounds and pads that degrade or lose effectiveness after a single application, this Thermal Pad can be removed and reapplied multiple times without compromising its thermal performance. This characteristic is particularly beneficial for technicians and engineers who frequently assemble and disassemble electronic devices, as it reduces waste and lowers overall maintenance costs.

Safety is a paramount concern in electronic components, and this Thermal Pad meets stringent flame rating requirements with a 94V-0 certification. This rating signifies that the material is highly flame retardant, self-extinguishing within 10 seconds without dripping, thereby providing an added layer of protection against fire hazards. Such a flame rating ensures compliance with industry standards and enhances the overall safety of the electronic systems in which the Thermal Pad is used.

In summary, this Thermal Pad Thermal Interface Material stands out as a reliable and efficient Thermal Gap Filler engineered to meet the demanding needs of modern electronics. Its optimal compression rate of 15% to 30%, low thermal resistance of 0.921 °C·in²/W, and specific gravity of 2.36 G/cc combine to deliver excellent thermal management performance. The pad’s reusability adds practical value, while its 94V-0 flame rating assures safety and compliance. Whether you are looking to improve heat dissipation in high-performance computing devices or enhance the thermal management of power electronics, this Thermal Pad offers a durable, effective, and safe solution to keep your devices running cooler and longer.

Features:

• Product Name: Thermal Pad
• Operating Temperature Range: -40°C to 150°C
• Dielectric Strength: 10 KV/mm
• Hardness: Shore 00 60
• Thermal Conductivity: 2.0 W/mK
• Functions as an effective Thermal Gap Filler
• Serves as a reliable Thermal Conductive Sheet
• Excellent performance as a Thermal Gap Filler for electronic components

Technical Parameters:

Applications:

The Union Tenda LC200 Thermal Pad is a high-quality thermal interface material designed to efficiently dissipate heat between electronic components and heat sinks. Manufactured in China, this silicone rubber thermal conductive pad boasts a Shore 00 hardness of 60 and a compression rate ranging from 15% to 30%, ensuring optimal softness and conformability for superior heat transfer. Certified with RoHS and REACH standards, the LC200 model is environmentally friendly and safe for use in various electronic applications.

This thermal conductive sheet is ideal for a wide range of product application occasions and scenarios where effective heat management is critical. It is commonly used in electronic devices such as CPUs, GPUs, power modules, LED lighting, and telecommunications equipment. The thermal pad acts as a reliable thermal interface material, filling microscopic gaps between heat sinks and electronic components, thereby enhancing thermal conductivity and preventing overheating issues that could compromise device performance and longevity.

Union Tenda’s LC200 thermal conductive pad is particularly suited for mass production environments due to its minimum order quantity of 1000 units and a supply ability of 2 tons per day. Its packaging comes in convenient cartons sized 24*22*6cm or 42*22*11cm, allowing for easy storage and transportation. With a competitive price range of 0.01 to 10 USD, it offers an economical solution for manufacturers seeking efficient heat dissipation materials.

The thermal pad’s reusability adds to its appeal, making it a cost-effective choice for repairs, upgrades, and prototyping in electronics manufacturing and maintenance. Its fast delivery time of 3 to 5 days and payment terms via TT further streamline procurement processes for businesses.

In summary, the Union Tenda LC200 thermal conductive pad is a versatile and durable thermal interface material, perfect for applications requiring effective heat dissipation between electronic components and heat sinks. Whether for industrial production or specialized electronics assembly, this thermal conductive sheet delivers reliable performance, environmental compliance, and excellent value.