1.5W/m·K Flexible Thermally Conductive Silicone Pad For BMS / ECU

Product Description:

The Thermal Pad is an advanced Heat Dissipation Pad designed to provide exceptional thermal management in a wide range of electronic applications. As a high-performance Thermal Interface Material, this product plays a crucial role in enhancing the efficiency and reliability of electronic devices by effectively transferring heat away from critical components. Its primary function is to serve as a Thermal Gap Filler, bridging the microscopic air gaps between heat-generating components and heat sinks, thereby ensuring optimal thermal conductivity and preventing overheating.

One of the key features of this Thermal Pad is its excellent electrical insulation properties. This makes it an ideal choice for applications where electrical isolation is essential to prevent short circuits and protect sensitive electronic parts. The pad’s electrical insulation capability ensures safety and reliability without compromising its thermal performance, making it suitable for use in a variety of electronic assemblies including power modules, LED lighting, telecommunications equipment, and automotive electronics.

With a specific gravity of 1.9 g/cm³, this Thermal Pad offers a balanced density that contributes to its stability and durability during operation. This density ensures that the pad maintains its structural integrity under mechanical stress and thermal cycling, which is common in electronic devices. It provides a consistent thermal interface throughout the lifespan of the product, reducing the risk of thermal degradation and ensuring long-term performance.

Durability and safety are further enhanced by the Thermal Pad’s impressive flammability rating of UL94 V-0. This rating indicates that the material is highly flame retardant, self-extinguishing within 10 seconds after exposure to a flame, and does not produce flaming drips. Such a safety feature is critical in electronic applications where fire hazards must be minimized to protect both the device and the end-user. The UL94 V-0 rating certifies that this Thermal Interface Material complies with stringent safety standards, providing peace of mind to manufacturers and consumers alike.

The pad’s hardness is measured at Shore 00 50, which strikes an excellent balance between softness and firmness. This level of hardness allows the Thermal Gap Filler to conform easily to uneven surfaces and fill gaps effectively, ensuring maximum contact area for heat transfer. At the same time, it is firm enough to maintain its shape and resist deformation under compression, which is vital for maintaining consistent thermal conductivity over time. This unique hardness characteristic enhances the pad’s reliability and efficiency as a thermal interface solution.

Additionally, the manufacturer offers a free sample of this Thermal Pad, allowing engineers and product designers to evaluate its performance and suitability for their specific applications before committing to larger orders. This sample availability reflects confidence in the product’s quality and effectiveness, and provides an opportunity for potential users to experience firsthand the benefits of this advanced Thermal Interface Material.

In summary, this Thermal Pad stands out as a superior Heat Dissipation Pad that combines excellent electrical insulation, optimal specific gravity, high flame retardancy, and balanced hardness to deliver reliable thermal management solutions. Whether used as a Thermal Interface Material or a Thermal Gap Filler, it significantly enhances the thermal performance and safety of electronic devices. Its combination of physical and chemical properties makes it an indispensable component in the design and manufacturing of modern electronics, ensuring devices operate efficiently, safely, and with extended longevity.

Features:

• Product Name: Thermal Pad
• Dimensions: 200 mm x 400 mm or customization available
• Material: Ceramic filled silicone elastomer
• Electrical Insulation: Yes
• Application: Used as a thermal interface material between chip, processor, storage device, and heat sink or casing
• Excellent heat dissipation properties as a Heat Dissipation Pad
• High thermal conductivity as a Thermal Conductive Pad
• Provides efficient heat transfer and protection for electronic components

Technical Parameters:

Applications:

The Union Tenda LC200 Thermal Silicone Pad is a high-performance Thermal Interface Material designed to meet the demanding needs of modern electronic cooling applications. Manufactured in China and certified with RoHS and REACH standards, this silicone-based Heat Dissipation Pad offers exceptional thermal conductivity of 1.5 W/mK, ensuring efficient heat transfer between components and heat sinks. Its ultra-soft and flexible nature allows it to conform perfectly to uneven surfaces, providing optimal thermal contact and minimizing thermal resistance in various scenarios.

Ideal for use in electronics manufacturing, the LC200 Thermal Conductive Sheet is commonly applied in devices such as CPUs, GPUs, power amplifiers, LED lighting systems, and automotive electronics where heat management is critical. This product excels in scenarios requiring reliable electrical insulation combined with superior heat conduction, thanks to its silicone material and UL94 V-0 flammability rating. It effectively prevents overheating, enhancing device longevity and performance.

In industrial settings, the LC200 Thermal Silicone Pad is favored for assembling telecommunications equipment, industrial power supplies, and renewable energy systems like solar inverters, where stable thermal management can improve system reliability. Its flexible heat dissipation properties also make it an excellent choice for battery packs in electric vehicles and portable devices, promoting safety and efficiency.

The packaging options, including cartons sized 24*22*6 cm and 42*22*11 cm, ensure safe delivery with a quick turnaround time of 3 to 5 days. With a supply capacity of 2 tons per day and a minimum order quantity of 1000 pieces, Union Tenda meets both small and large-scale production demands. Pricing ranges from $0.01 to $10 USD per unit, making it a cost-effective solution for diverse applications.

Payment terms via TT provide flexibility for international clients, supporting smooth procurement processes. Overall, the Union Tenda LC200 Thermal Conductive Silicone Pad is a reliable, efficient, and versatile Thermal Interface Material that seamlessly integrates into various electronics and industrial scenarios requiring advanced heat dissipation solutions.