Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com
86-755-29082440
Product Details
Place of Origin: Guangdong,China
Brand Name: Union Tenda
Certification: RoHS、REACH、UL
Model Number: LCM500
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Name:
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5 W/m·K Thermal Phase Change Pad
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Thickness:
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0.13/0.2/0.25 Mm
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Phase Change Temperature:
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30~45℃
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Thermal Conductivity:
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5.0±0.3 W/m·K
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Operating Temperature:
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-55~125
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Enthalpy Of Fusion:
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1.65 J/g
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Name:
|
5 W/m·K Thermal Phase Change Pad
|
|
Thickness:
|
0.13/0.2/0.25 Mm
|
|
Phase Change Temperature:
|
30~45℃
|
|
Thermal Conductivity:
|
5.0±0.3 W/m·K
|
|
Operating Temperature:
|
-55~125
|
|
Enthalpy Of Fusion:
|
1.65 J/g
|
5 W/m·K 0.13mm 1.65 J/g PCM Phase Change Material Thermal Conductive Pad Heat Dissipation Pads
Thermal Phase Change Pad | LCM500
The LCM500 thermal phase change pad is solid at room temperature for easy installation between heat sinks and components. When it reaches the product's phase transition temperature, the material turns liquid and flows to fill the tiny irregular contact surfaces of the device, completely bridging gaps on the contact surface to minimize interfacial thermal resistance.
It maintains excellent stable performance during high-reliability testing required for long-service-life applications, without issues of silicone oil bleeding. Its low thermal resistance significantly enhances heat sink performance. This ability to completely fill air gaps at the interface demonstrates excellent wetting performance within the typical operating temperature range, achieving extremely low surface contact thermal resistance.
With high reliability and low thermal impedance, this phase change material makes LCM an ideal choice for high-performance integrated circuit components.
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Test Items |
Unit |
LCM500 |
Test Standard |
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Appearance |
- |
Gray |
Visual |
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Thickness |
mm |
0.13/0.2/0.25 |
ASTM D374/374M |
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Density |
g/cm3 |
2.54±0.20 |
ASTM D792 |
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Phase change temperature |
℃ |
30~45 |
ISO 11357-3 |
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Enthalpy of fusion |
J/g |
1.65 |
ISO 11357-3 |
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Volume resistivity |
Ω·cm |
≥1×1014 |
ASTM D257 |
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Thermal Conductivity |
W/m·K |
5.0±0.3 |
ISO 22007-2 |
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Thermal Conductivity |
W/m·K |
5.0±0.3 |
ASTM D5470 |
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Thermal Impedance |
℃·in²/W |
0.008 |
ASTM D5470(40psi@BLT) |
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Thermal Impedance |
℃·cm²/W |
0.051 |
ASTM D5470(40psi@BLT ) |
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Operating Temperature |
℃ |
-55~125 |
- |
Features and Advantages
-Extremely reliable stability
-Optimal surface wettability
-Adaptive temperature management
-Excellent filling performance
Typical Applications
-Suitable for thermal conduction applications between heat-generating electronic components such as integrated circuits (IC), central processing units (CPU), graphics processing units (GPU), and LED lamps, and heat sinks.
-Used for thermal management of power modules and power semiconductors.
-Applied for thermal conduction in vehicle battery management systems (BMS), engine control units (ECU), etc.
-Utilized for thermal conduction in routers and base station equipment.
