Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com
86-755-29082440
Product Details
Place of Origin: Guangdong,China
Brand Name: Union Tenda
Certification: RoHS、REACH、UL
Model Number: LEN200
|
Features:
|
Non-silicone Formulation, No Silicone Oil Leakage
|
Name:
|
2.0 W/m·K Silicone-Free Phase Change Thermal Grease
|
Thermal Conductivity:
|
2.0±0.2 W/m·K
|
Operating Temperature:
|
-40~150 ℃
|
Density:
|
2.82±0.2 G/cm3
|
|
Features:
|
Non-silicone Formulation, No Silicone Oil Leakage
|
|
Name:
|
2.0 W/m·K Silicone-Free Phase Change Thermal Grease
|
|
Thermal Conductivity:
|
2.0±0.2 W/m·K
|
|
Operating Temperature:
|
-40~150 ℃
|
|
Density:
|
2.82±0.2 G/cm3
|
2.0 W/m·K Silicone-Free Phase Change Thermal Grease Thermal Interface Material Thermal Paste
Non-Silicone Phase Change Thermal Grease | LEN200
The LEN200 series is a non-silicone phase change thermal grease that undergoes a phase change when the ambient temperature reaches 45°C. This ensures maximum surface conformity, fully wetting the thermal surfaces, thereby minimizing contact thermal resistance.
It eliminates the problem of silicone oil pump-out, offering high reliability. It is easy to use and can be applied through screen printing, manual application, or automatic dispensing.
|
Test Items |
Unit |
LEN200 |
Test Standard |
|
Appearance |
- |
White |
Visual |
|
Density |
g/cm3 |
2.82±0.2 |
ASTM D792 |
|
Bond Line Thickness (BLT) |
μm |
≤10 |
- |
|
Dielectric Strength |
KV/mm |
≥6 |
ASTM D149 |
|
Dielectric Constant |
- |
5.10 |
ASTM D150 |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ISO 22007-2 |
|
Thermal Impedance |
℃·in²/W |
0.026 |
ASTM D5470(40psi@BLT) |
|
Thermal Impedance |
℃·cm²/W |
0.170 |
ASTM D5470(40psi@BLT ) |
|
Operating Temperature |
℃ |
-40~150 |
- |
Features and Advantages
-Non-silicone formulation, no silicone oil leakage
-Reliable stability
-Optimal surface wetting
-Adjustable viscosity for greater operational flexibility
Typical Applications
-Thermal management between heat-generating electronic components such as integrated circuits (ICs), central processing units (CPUs), graphics processing units (GPUs), and LED lighting, and heat sinks
-Thermal management in power modules and power semiconductors
-Thermal applications in vehicle battery management systems (BMS) and engine control units (ECU)
-Thermal management in routers and base station equipment
