3 W/m·K Thermal Conductive Silicone Pad Custom Die Cut Low Thermal Resistance Thermal Gap Filler Pad

3 W/m K Thermal Conductive Silicone Pad Custom Die-Cut Low Thermal Resistance Thermal Gap Filler Pad

Thermal Silicone Pad | LC300

The LC300 thermal silicone pad is a general-purpose, cost-effective thermal interface material with high cost performance. It is soft with natural slight stickiness, making it easy to assemble. Under low compression force, it exhibits good thermal conductivity and electrical insulation properties. It is placed in the gap between heat-generating components and heat sinks or machine casings, extruding air to achieve full contact and form a continuous thermal path. By using heat sinks or machine casings as heat dissipation devices, the effective heat dissipation area can be increased, thereby significantly improving cooling performance.

Features and Advantages

• Low cost, high efficiency, and high cost performance
  Natural stickiness, easy to assemble, and can be disassembled and reassembled multiple times
  Excellent softness and compressibility, capable of filling various uneven gaps of different sizes
  Extremely good weather resistance and aging resistance, suitable for long-term use

Typical Applications

• Thermal interface between chips, processors, storage devices, and heat sinks or casings
  Devices such as base stations and routers that require long-term stable cooling
  Thermal interface in automotive electronic control units (ECU) and battery management systems (BMS)
  Thermal management between power modules and heat sinks