Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com
86-755-29082440
Product Details
|
Name:
|
Silicone Thermal Interface Materials
|
Test Item:
|
Thermal Impedance
|
Unit:
|
℃-in^2/W
|
LE200:
|
0.090
|
Test Methods:
|
ASTM D5470
|
|
Name:
|
Silicone Thermal Interface Materials
|
|
Test Item:
|
Thermal Impedance
|
|
Unit:
|
℃-in^2/W
|
|
LE200:
|
0.090
|
|
Test Methods:
|
ASTM D5470
|
High-performance thermal interface material designed for superior heat dissipation in power devices, CPUs, and GPUs.
| Test Item | Unit | LE200 Value | Test Method |
|---|---|---|---|
| Color | - | White/Gray | Visually |
| Continuous Use Temp | ℃ | -40~150 | - |
| Weight Loss | % | ≤0.3 | @150℃240H |
| Breakdown Voltage | KV/mm | ≥10 | ASTM D149 |
| Volume Resistivity | Ω·cm | 9*10^11 | ASTM D257 |
| Dielectric Constant | @1MHz | 5.78 | ASTM D150 |
| Dielectric Dissipation | @1MHz | 6.49E-03 | ASTM D150 |
| Thermal Conductivity | W/m·K | 2.0 | ISO 22007-2 |
| Thermal Impedance | ℃-in^2/W | 0.090 | ASTM D5470 |
