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Home > products > Thermal Conductive Grease > LE300 Thermal Conductivity Silicone Grease Low Viscosity For CPU / GPU

LE300 Thermal Conductivity Silicone Grease Low Viscosity For CPU / GPU

Product Details

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CPU Thermal Conductivity Silicone Grease

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GPU Thermal Conductivity Silicone Grease

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Thermal Conductivity Silicone Grease Low Viscosity

Name:
Thermal Conductivity Silicone Grease
Test Item:
Thermal Impedance
Unit:
℃-in^2/W
LE300:
0.068
Test Methods:
ASTM D5470
Name:
Thermal Conductivity Silicone Grease
Test Item:
Thermal Impedance
Unit:
℃-in^2/W
LE300:
0.068
Test Methods:
ASTM D5470
LE300 Thermal Conductivity Silicone Grease Low Viscosity For CPU / GPU
 

LE300 Thermal Conductive Silicone Grease

Thermal conductive silicone grease has excellent thermal conductivity, good reliability, and reliable wettability on copper and aluminum surfaces. It is suitable for interface heat conduction of general CPU, GPU and other heating power devices.

Key Benefits

  • Superior Wettability: Low viscosity allows full contact surface wetting.
  • Optimized Thermal Flow: Eliminates air gaps to reduce thermal resistance.
  • Reliability: Enhances device longevity and operational stability.
  • Efficient Heat Transfer: Ideal for high-power heating devices.

Product Attributes

FOB Unit: Kilogram
Packaging: 1kg/can, 5kg/can, 10kg/barrel, 20kg/barrel

Technical Specifications

Test Item Unit Value (LE300) Test Method
Color - Gray Visually
Continuous Use Temp ℃ -40~150 -
Weight Loss % ≤0.3 @150℃240H
Breakdown Voltage KV/mm ≥8 ASTM D149
Volume Resistivity Ω·cm 1*10^11 ASTM D257
Dielectric Constant @1MHz 5.88 ASTM D150
Dielectric Dissipation @1MHz 3.58E-03 ASTM D150
Thermal Conductivity W/m·K 3.0 ISO 22007-2
Thermal Impedance ℃-in^2/W 0.068 ASTM D5470