Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com
86-755-29082440
Product Details
Payment & Shipping Terms
Payment Terms: T/T,D/P,D/A,L/C
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Name:
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Thermal Conductive Pad
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Thermal Conductivity:
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6.0±0.3 W/m·K
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Thickness:
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0.5~10 Mm
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Density:
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3.30±0.2 G/cm3
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Thermal Impedance:
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0.225 ℃·in²/W Or 1.454℃·cm²/W
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Name:
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Thermal Conductive Pad
|
|
Thermal Conductivity:
|
6.0±0.3 W/m·K
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|
Thickness:
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0.5~10 Mm
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|
Density:
|
3.30±0.2 G/cm3
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|
Thermal Impedance:
|
0.225 ℃·in²/W Or 1.454℃·cm²/W
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6 W/m K 0.5-10 mm Thickness LC600 Low Thermal Resistance Thermal Conductive Silicone Pad Thermal Transfer Pad Sheet
Thermal Silicone Pad | LC600
The LC600 thermal conductive silicone pad is a high thermal conductivity gap filler pad with excellent thermal performance. It is soft, slightly adhesive, and easy to assemble. Under low compression force, it demonstrates good thermal conductivity and electrical insulation properties. It is placed between heat-generating components and heat sinks or device enclosures, expelling air to ensure full contact and form a continuous thermal conduction path. By using the heat sink or device enclosure as a cooling component, the heat dissipation area is effectively increased, significantly enhancing cooling efficiency.
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Test Items |
Unit |
LC600 |
Test Standard |
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Appearance |
- |
Gray |
Visual |
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Thickness |
mm |
0.5~10 |
ASTM D374/374M |
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Hardness |
Shore AO |
30±5 |
ISO 48-4 |
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Hardness |
Shore OO |
60±10 |
ASTM D2240 |
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Density |
g/cm3 |
3.30±0.2 |
ASTM D792 |
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Tensile Strength |
MPa |
≥0.10 |
ASTM D412 |
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Elongation at Break |
% |
≥40 |
ASTM D412 |
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Dielectric Strength |
KV/mm |
≥10 |
ASTM D149 |
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Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
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Weight Loss |
% |
≤0.3 |
150℃240H |
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Dielectric Constant |
1MHz |
7.5-8.4 |
ASTM D150 |
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Thermal Conductivity |
W/m·K |
6.0±0.3 |
ISO 22007-2 |
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Thermal Conductivity |
W/m·K |
6.0±0.3 |
ASTM D5470 (Three thickness fitting) |
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Thermal Impedance |
℃·in²/W |
0.225 |
ASTM D5470(1mm 10psi) |
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Thermal Impedance |
℃·cm²/W |
1.454 |
ASTM D5470(1mm 10psi) |
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Flammability |
Class |
V-0 |
UL94 |
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Operating Temperature |
℃ |
-40~200 |
- |
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Specific Heat Capacity |
J/(g/K) |
0.906 |
ASTM E1269 |
Features and Advantages
-High thermal conductivity reduces the risk of overheating.
-Naturally adhesive, easy to assemble, and allows for repeated disassembly and reassembly.
-Excellent softness and compressibility, capable of filling various uneven gaps of different sizes.
-Exceptional weather and aging resistance, making it suitable for long-term use.
Typical Applications
-Used for thermal conduction between CPUs, GPUs, and other high-heat-generating components and heat sinks.
-Suitable for devices requiring long-term stable heat dissipation, such as base stations and routers.
-Applied to areas needing heat dissipation in automotive batteries, electronic control units (ECU), motor control modules, and LED lights.
-Used for thermal management in AC/DC power supplies, inverters, and UPS (uninterruptible power supply) systems.
High performance silicone thermal pad, flexible thermal gap filler with low thermal resistance. Soft & compressible to fill gaps between heat sink and electronic components. Good electrical insulation, high temperature resistance, RoHS & UL certified. Custom die-cut size & thermal conductivity available. Widely used for power supply, LED, PCB, new energy and industrial electronics cooling, factory sample & OEM service supported.
