Shenzhen Union Tenda Technology Co., Ltd.
tang@szutd.com
86-755-29082440
Product Details
Place of Origin: Guangdong,China
Brand Name: Union Tenda
Certification: RoHS,UL,Reach
Model Number: LC200
Payment & Shipping Terms
Minimum Order Quantity: 100pcs
Delivery Time: 7 days
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Appearance:
|
Gray-White
|
Thickness:
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0.3~15mm
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Hardness:
|
Shore OO 60±10 ASTM D2240 Test Standard
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Density:
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2.36±0.2 G/cm3 ASTM D792 Test Standard
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Size:
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Customized
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Name:
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Thermal Conductive Pad
|
|
Appearance:
|
Gray-White
|
|
Thickness:
|
0.3~15mm
|
|
Hardness:
|
Shore OO 60±10 ASTM D2240 Test Standard
|
|
Density:
|
2.36±0.2 G/cm3 ASTM D792 Test Standard
|
|
Size:
|
Customized
|
|
Name:
|
Thermal Conductive Pad
|
LTD 2 W/m-K 0.3-15mm Thickness High Thermal Conductivity Silicone Thermal Pad Self-adhesive Sheet GPU CPU Heat Dissipation Pad
Thermal Silicone Pad | LC200
The LC200 thermal silicone pad is a general-purpose, cost-effective thermal interface material with high cost performance. It is soft with natural slight stickiness, making it easy to assemble. Under low compression force, it exhibits good thermal conductivity and electrical insulation properties. It is placed in the gap between heat-generating components and heat sinks or machine casings, extruding air to achieve full contact and form a continuous thermal path. By using heat sinks or machine casings as heat dissipation devices, the effective heat dissipation area can be increased, significantly improving cooling performance.
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Test Items |
Unit |
LC200 |
Test Standard |
|
Appearance |
- |
Gray-White |
Visual |
|
Thickness |
mm |
0.3~15 |
ASTM D374/374M |
|
Hardness |
Shore AO |
30±5 |
ISO 48-4 |
|
Hardness |
Shore OO |
60±10 |
ASTM D2240 |
|
Density |
g/cm3 |
2.36±0.2 |
ASTM D792 |
|
Tensile Strength |
MPa |
≥0.30 |
ASTM D412 |
|
Elongation at Break |
% |
≥100 |
ASTM D412 |
|
Dielectric Strength |
KV/mm |
≥10 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
|
Weight Loss |
% |
≤0.3 |
150℃240H |
|
Dielectric Constant |
1MHz |
4.8~5.5 |
ASTM D150 |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ASTM D5470 (Three thickness fitting) |
|
Thermal Impedance |
℃·in²/W |
0.921 |
ASTM D5470(1mm 10psi) |
|
Thermal Impedance |
℃·cm²/W |
5.939 |
ASTM D5470(1mm 10psi) |
|
Flammability |
Class |
V-0 |
UL94 |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
0.938 |
ASTM E1269 |
Features and Advantages:
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l Low cost, high efficiency, and high cost performance |
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l Natural stickiness, easy to assemble, and can be disassembled and reassembled multiple times |
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l Excellent softness and compressibility, capable of filling various uneven gaps of different sizes |
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l Extremely good weather resistance and aging resistance, suitable for long-term use |
Typical Applications:
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l Thermal interface between chips, processors, storage devices, and heat sinks or casings |
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l Devices such as base stations and routers that require long-term stable cooling |
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l Thermal interface in automotive electronic control units (ECU) and battery management systems (BMS) |
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l Thermal management between power modules and heat sinks
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Application Instructions
Surface Preparation: Ensure that the surface is clean, oil-free, and dust-free, with no noticeable burrs, to improve contact between the thermal silicone pad and the device.
Cutting and Placement: Cut the thermal silicone pad according to the required size of the device. After cutting, gently place the silicone pad onto the heat-generating component, ensuring it fully covers the heat source area.
Pressing and Fixing: Apply appropriate pressure during installation to fill the gap between the device and the heat sink, ensuring good thermal contact. The silicone pad has slight stickiness and can be directly adhered for fixing.
Thickness Selection: Choose a suitable thickness based on the device’s contact gap. It is recommended that the compression ratio of the silicone pad during installation be controlled between 15% and 30%.
